Codes & Standards - Purchase
IEC 60749-35:2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
SKU: iec_003382_036367
Published by IEC
Publication Year 2006
1.0 Edition
43 pages
Product Details
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.