Codes & Standards - Purchase
IEC 60749-14:2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
SKU: iec_003344_030988
Published by IEC
Publication Year 2003
1.0 Edition
27 pages
Product Details
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.
Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.